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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

by Michael G. Pecht

$217.99Hardcover

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Free standard shipping on orders over $40. ISBN 9780471594468

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Details

Format
Hardcover
ISBN-13
9780471594468
Publisher
Wiley-Interscience
Published
March 31, 1994
Pages
464
Weight
29.6 oz
Subject
Technology & Engineering

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