Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
$217.99Hardcover
In stock, ships in 1-2 business days
Free standard shipping on orders over $40. ISBN 9780471594468
1
Details
- Format
- Hardcover
- ISBN-13
- 9780471594468
- Publisher
- Wiley-Interscience
- Published
- March 31, 1994
- Pages
- 464
- Weight
- 29.6 oz
- Subject
- Technology & Engineering
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