Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics: Volume 990: Symposium Held April 10 12, 20
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics: Volume 990: Symposium Held April 10 12, 20
$47.99Paperback
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Free standard shipping on orders over $40. ISBN 9781107408715
1
Details
- Format
- Paperback
- ISBN-13
- 9781107408715
- Publisher
- Cambridge University Press
- Published
- June 5, 2014
- Pages
- 358
- Weight
- 16.8 oz
- Subject
- Technology & Engineering
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