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Modeling and Simulation for Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly

by Shen Liu

$184.99Hardcover

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Free standard shipping on orders over $40. ISBN 9780470827802

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Details

Format
Hardcover
ISBN-13
9780470827802
Publisher
Wiley
Published
May 17, 2011
Pages
576
Weight
40 oz
Subject
Technology & Engineering

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