Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices
Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices
by Xingyou Tian
$209.99Hardcover
In stock, ships in 1-2 business days
Free standard shipping on orders over $40. ISBN 9783527352425
1
Details
- Format
- Hardcover
- ISBN-13
- 9783527352425
- Publisher
- Wiley-Vch
- Published
- December 18, 2023
- Pages
- 368
- Weight
- 30.6 oz
- Subject
- Science
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