Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
by Beth Keser
$155.99Hardcover
In stock, ships in 1-2 business days
Free standard shipping on orders over $40. ISBN 9781119314134
1
Details
- Format
- Hardcover
- ISBN-13
- 9781119314134
- Publisher
- Wiley-IEEE Press
- Published
- February 12, 2019
- Pages
- 576
- Weight
- 34.4 oz
- Subject
- Technology & Engineering
More by Beth Keser
All booksPopular in Technology & Engineering
Browse Technology & Engineering
Kobuk the Destroyer: And Other Tales from the Wild, Unseen World of Test Engineering
Alex Davies
$23.99
The Collision: What AI Does to Us
Eric C. So
$23.99
Rise of the Robots: Technology and the Threat of a Jobless Future
Martin Ford
$17.99
Wired Wisdom: How to Age Better Online
Eszter Hargittai
$16.99
The Secret Life of Circuits: An Illustrated Guide to Electronic Circuit Design
Michal Zalewski
$31.99
Mothers of Invention: A History of Creativity from the Greek Muses
Moiya McTier
$22.99
Invent Now: The Next Leap in Moonshots
Salima Bhimani
$27.99
Contracting for Integrated Project Delivery: Structuring Collaborative Projects for Global Success
Howard W. Ashcraft
$80.99
Localization in Wireless Networks: Technologies and Applications
Nasir Saeed
$136.99
Advanced Fault Current Limiters: Definition, Design, and Future Trends
Amir Heidary
$136.99
Computational Chemical Reaction Engineering: Modeling, Simulation, and Design with MATLAB
Kamal I. M. Al-Malah
$168.99
Cyber-Secure Load Frequency Control for Power Systems
Xinghua Liu
$140.99