Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package
by Beth Keser
$155.99Hardcover
In stock, ships in 1-2 business days
Free standard shipping on orders over $40. ISBN 9781119793779
1
Details
- Format
- Hardcover
- ISBN-13
- 9781119793779
- Publisher
- Wiley-IEEE Press
- Published
- December 29, 2021
- Pages
- 320
- Weight
- 20.8 oz
- Subject
- Technology & Engineering
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