Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
by Way Kuo
$195.99Paperback
In stock, ships in 1-2 business days
Free standard shipping on orders over $40. ISBN 9781461375968
1
Formats and editions
Details
- Format
- Paperback
- ISBN-13
- 9781461375968
- Publisher
- Springer
- Published
- March 14, 2014
- Pages
- 394
- Weight
- 20.8 oz
- Subject
- Technology & Engineering
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