Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
by Way Kuo
$195.99Hardcover
In stock, ships in 1-2 business days
Free standard shipping on orders over $40. ISBN 9780792381075
1
Formats and editions
Details
- Format
- Hardcover
- ISBN-13
- 9780792381075
- Publisher
- Springer
- Published
- January 31, 1998
- Pages
- 394
- Weight
- 25.9 oz
- Subject
- Technology & Engineering
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